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Edsyn TSX70 SOLDAVAC SMT Reflow Vacuum Workstation



The TSX70 is a station designed to remove solder bridges from fine-pitch components and also as a site preparation tool for BGA and fine-pitch PLCC's.

  • Specifically designed for BGA site preparation.
  • Can be used for fine pitch PLCC reattach operation.
  • Both vacuum and air flow are adjustable.
  • Used in many BGA rework operational instructions.
  • Temperature Range: 400-800F.
  • Shop Air Required: 1x70 psi, 1x40 psi.
  • Weight: 7.5 lbs.
  • Power Requirements: 120V, 60Hz.

Additional Information

Manufactured By: Edsyn
GoKimco Part #: EDS-TSX70
Manufacture Part Number (MPN): TSX70
Weight 2.1000
Country of Manufacture

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