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Indium 800164-500G Water Soluble PB-Free Solder Paste, 500g Jar

Stock Item
Indium_800164_Solder Paste


The Indium 800164 Water Soluble PB-Free Solder Paste is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems.

Just the facts for Indium3.2 Solder Paste

  • Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures
  • Superior fine-pitch soldering ability
  • Wide reflow profile window
  • Excellent response-to-pause printing performance
  • Outstanding slump resistance
  • Low voiding
  • Minimal foaming during the cleaning process
  • Excellent wetting
  • Keep Refrigerated - ships overnight

Made in the USA

Need more facts? Check below for our technical data sheet just in case.
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Product Attachments

View File800164 Data Sheet

Additional Information

Manufactured By: Indium
GoKimco Part #: IND-800164-500G
Manufacture Part Number (MPN): 800164-500G
Weight 1.5000
Country of Manufacture United States

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