The Indium 800164 Water Soluble PB-Free Solder Paste is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems.
Just the facts for Indium3.2 Solder Paste
- Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures
- Superior fine-pitch soldering ability
- Wide reflow profile window
- Excellent response-to-pause printing performance
- Outstanding slump resistance
- Low voiding
- Minimal foaming during the cleaning process
- Excellent wetting
- Keep Refrigerated - ships overnight
Need more facts? Check below for our technical data sheet just in case.
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|GoKimco Part #:||IND-800164-500G|
|Manufacture Part Number (MPN):||800164-500G|
|Country of Manufacture||United States|