The Kester EM907 SAC305 Lead Free, No Clean Solder Paste, 70-0605-0811, is a SAC305 lead-free, air and nitrogen reflowable solder paste specifically designed for the thermal requirements of lead-free alloys. .
Kester 70-0605-0811 Features:
- Capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading
- Excellent continual printability for fine pitch (0.4mm/16 mils)
- Prints at high speeds up to 6"/sec. (150 mm/sec.).
- Tin/silver/copper alloy: Sn96.5/Ag3.0/Cu0.5
- Powder mesh size: -325/+500 (Type 3)
- SAC305 Alloy
|GoKimco Part #:||K-7006050811|
|Manufacture Part Number (MPN):||70-0605-0811|
|Country of Manufacture||United States|