Metcal has designed a unique tool, Component Stenciling Templates, for printing on the underside of components. This easy procedure is designed for use on PBGA, CBGA, CSP balled devices as well as Land Grid Array (LGA) components. This is an ideal process for small components and situations where traditional stencil access is limited by the close proximity of adjacent components.
|GoKimco Part #:||OK-BST-256FP|
|Manufacture Part Number (MPN):||BST-256FP|
|Country of Manufacture||China|