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Metcal BST-256FP BGA Component Stenciling Templates Fine Pitch 256 Full Matrix Array


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Metcal has designed a unique tool, Component Stenciling Templates, for printing on the underside of components. This easy procedure is designed for use on PBGA, CBGA, CSP balled devices as well as Land Grid Array (LGA) components. This is an ideal process for small components and situations where traditional stencil access is limited by the close proximity of adjacent components.

Additional Information

Manufactured By: Metcal
GoKimco Part #: OK-BST-256FP
Manufacture Part Number (MPN): BST-256FP
Weight 1.2000
Country of Manufacture China

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