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Kester

Kester NXG1 SAC305 No-Clean Solder Paste for Lead-Free Applications, 500 gram Jar | 70-3213-0810

$66.43

Normally a Stock Item

Kester NXG1 Lead Free Solder Paste 500 gram jar

Details

The Kester NXG1 SAC305 Alloy ( Sn96.5Ag3.0Cu0.5 ) 7032130810 is a No-Clean Soldering Paste.  

SAC305 alloy is free of lead ( lead-free ).

The paste can be reflowed in air and nitrogen reflowable.

The flux is designed as a no-clean and meets the thermal requirements of lead free alloys.

Additional Kester Features:

  • The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys
  • The flux is classified as Type ROL1 flux under IPC ANSI/J-STD-004B
  • Excellent wetting to a variety of metals
  • Capable of print speeds up to 200 mm/sec (8 in/sec) 
  • Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs 
  • Excellent release from stencil
  • Long stencil and tack life (process dependent) 
  • Low voiding behavior
  • Capable of 120 minute break times in printing 
  • Clean cosmetic aesthetics after reflow
  • Resistant to slump
  • Longest shelf life at 8 months 
  • Reflowable in air or nitrogen
  • Kester Part number 70-3213-0810 or refered to as 7032130810

Product Attachments

Additional Information

Manufactured By: Kester
GoKimco Part #: K-7032130810
Manufacture Part Number (MPN): 70-3213-0810
Weight 3.0000
Country of Manufacture United States

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