Kester EM907 SAC305 Solder Paste, No Clean, 600gr Cartridge | 70-0605-0811 Case of 10

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EM907 Solder Paste , Case of 10 Tubes

Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s). This solder paste also exceeds the reliability standards required by J-STD-004.

Kester 70-0605-0811 Features:

• Capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading
• Excellent continual printability for fine pitch (0.4mm/16 mils)
• Prints at high speeds up to 6"/sec. (150 mm/sec.).
• Tin/silver/copper alloy: Sn96.5/Ag3.0/Cu0.5
• Powder mesh size: -325/+500 (Type 3)
• SAC305 Alloy
• 10 per case/Price per case

Kester SDS for EM907 Solder Paste

Keseter TDS for EM907 Solder Paste