The Indium 800514 PB-Free SAC305 Solder Paste is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium8.9E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Just the facts for Indium8.9E 800514 Solder Paste
- High transfer efficiency through small apertures (≤ 0.66AR)
- Eliminates graping phenomenon on small deposits
- Low voiding in BGA/CSP solder joints
- Keep Refrigerated - ships overnight
Need more facts? Check below for our technical data sheet just in case.
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