indium-800164-500g-water-soluble-pb-free-solder-paste-500g-jar
$114.00
SKU IND-800164-500G
The Indium 800164 Water Soluble PB-Free Solder Paste is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems.
Just the facts for Indium3.2 Solder Paste:
- Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures
- Superior fine-pitch soldering ability
- Wide reflow profile window
- Excellent response-to-pause printing performance
- Outstanding slump resistance
- Low voiding
- Minimal foaming during the cleaning process
- Excellent wetting
- Keep Refrigerated - ships overnight
Need more facts? Check below for our technical data sheet just in case.
Got a question? Send us an email info@gokimco.com or give us a call - we can help!