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    SKU IND-800164-500G


    Satisfaction Guarantee

    The Indium 800164 Water Soluble PB-Free Solder Paste is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems.

    Just the facts for Indium3.2 Solder Paste:

      • Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures
      • Superior fine-pitch soldering ability
      • Wide reflow profile window
      • Excellent response-to-pause printing performance
      • Outstanding slump resistance
      • Low voiding
      • Minimal foaming during the cleaning process
      • Excellent wetting
      • Keep Refrigerated - ships overnight

    Made in the USA

    Need more facts? Check below for our technical data sheet just in case.
    Got a question? Send us an email info@gokimco.com or give us a call - we can help!